NIT is quickly ramping up with production of InGaAs stacked sensors

Jul 26, 2022 | News

NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.

One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.

The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.

Number of hybrid InGaAs sensors produced with the in house process developed by NIT

Recent news

New release of NITVision version 1.3

New release of NITVision version 1.3

New release of NITVision software: Version 1.3 integrates now Python Scripting NITVision 1.3 now integrates the possibility for users to insert custom python scripts directly into NITVision’s image processing pipeline. This new feature allows any user to expand the...

April upcoming events & new software updates

April upcoming events & new software updates

5th - 7th, April SPIE DEFENSE + COMMERCIAL SENSING Orlando, Florida, United StatesA hands-on demonstration of SenS 1280 Our Sales Director, Régis Tulaza, will join the Sierra-Olympic Technologies team throughout the show.Stop by booth #1508, in Orlando, Florida,...

Best Wishes For 2022 From NIT

Best Wishes For 2022 From NIT

HAPPY HOLIDAYS! Merry Christmas and a Happy New Year. All for SWIR In 2021, despite the bumpy year, NIT is proud to have expanded the SWIR product line with plenty of state-of-the-art products to fit any application requirements: LiSaSWIR 2048 - Line-scan array SWIR...