NIT is quickly ramping up with production of InGaAs stacked sensors

Jul 26, 2022 | News

NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.

One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip chip process insuring high yield and low cost of production.

The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.

Number of hybrid InGaAs sensors produced with the in house process developed by NIT

Recent news

NIT has designed a specific “Soft Trigger” mode for its flagship WiDy SenS VGA InGaAs SWIR GigE Vision camera

NIT has designed a specific “Soft Trigger” mode for its flagship WiDy SenS VGA InGaAs SWIR GigE Vision camera

To fulfill the need for a fast and precise process monitoring, NIT has designed a specific “Soft Trigger” mode for its flagship WiDy SenS VGA InGaAs SWIR GigE Vision camera. This mode reduces the latency between the beginning of the exposure time and delivery to the host system of the produced image. Therefore, the inspection system increases the checking rate.