NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Happy Holidays! Wishing you a Merry Christmas & Happy New Year. As we say farewell to 2022, the NIT team would like to thank you for being a part of our community and contributing to our success this past year. We are thankful to our amazing clients and our valued...
NIT, together with its US distributor Pembroke Instruments, have experienced large growth over the last years. The demand for our SWIR cameras is expanding from our large US customer base in the vision industry and defense. To support this expansion, NIT is pleased to...
NIT is widely known for its large range of SWIR cameras designed for industrial, defense, and medical markets. Less known is that NIT designs and manufactures in-house all the InGaAs sensors embedded into our cameras. We master the design of silicon read-out circuits,...