NIT is quickly ramping up with production of InGaAs stacked sensors

Jul 26, 2022 | News

NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.

One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip chip process insuring high yield and low cost of production.

The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.

Number of hybrid InGaAs sensors produced with the in house process developed by NIT

Recent news

NIT will exhibit during the OPTRO 2020

NIT will exhibit during the OPTRO 2020

OPTRO 2020 (28-30 January 2020 - OECD Paris) - Booth #6 New Imaging Technologies (NIT) will exhibit and demonstrate its line of SWIR InGaAs cameras dedicated to Defense and Security applications. Specific applications dedicated to Gated Imaging, Laser Detection and...