NIT is quickly ramping up with production of InGaAs stacked sensors

Jul 26, 2022 | News

NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.

One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.

The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.

Number of hybrid InGaAs sensors produced with the in house process developed by NIT

Recent news

SEMICON West invitation

SEMICON West invitation

Join us at booth #1854, SEMICON WEST 2021 from December 7th - 9th. We are excited to meet you in person and present our SWIR solutions to enhance your vision requirements. Don't miss the chance to test our SWIR cameras' performances on-site and discuss with our...

New GUIs and SDKs updates

New GUIs and SDKs updates

The new versions of NITLibrary (v3.2) and NITVision GUI (v1.2) are now available for download. In this new version, new cameras are supported: WiDy SenS 320 with USB3.0 interface (V-ST) SenS 1280 with CameraLink interface (M-ST) This update expands the range of...