NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
As 2017 draws to a close, so does the NIT monthly Press release. This year, celebrating the 10th anniversary of NIT, was a successful year for NIT and its partners. We hope you enjoyed using NIT products and we would like to thank you for your loyalty and your...
NIT, the leader in WDR CMOS and SWIR solutions, has developed in recent years a complete offer in SWIR gating imaging in both QVGA (320x256) and VGA (640x512) resolution, available in Compact or Smart cameras series (USB3.0, Camlink). Thanks to its patented...
NIT, a leader in Wide Dynamic Range imaging solution for the visible and SWIR, is introducing on the market this month two new Smart MAGIC camera products in visible with 1.3Mpixels NSC1003 (MC1003-1GB or C) and WVGA NSC1104 (MC1104-PGB). These compact and low power...