NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
WiDy SenS camera’s exclusive pixel structure combines a linear and logarithmic response, leading to the best trade-off on the market between high sensitivity and high dynamic range (>120 dB). This product is efficient to deal with fast variations of illumination...
New Imaging Technologies, the leader in WDR visible and SWIR solutions, invites you to visit its booth # 5713 in Hall W5 at Vision China 2018 Shanghai from March 14-16 for discovering its last novelties. At the menu, the following new courses will be demonstrated: Our...
The first preview of NIT’s latest innovation in InGaAs technology will be publicly released at Photonics West 2018, San Francisco, booth#841. The NSC1601T-SI all-purpose VGA 15µm sensor bridges the gap between high sensitivity and wide dynamic range with following...