NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
New Imaging Technologies - a leader in Wide Dynamic Range visible CMOS and SWIR solutions – is constantly creating innovations for users wishing to improve their knowledge through vision. From its experience acquired with Smart WiDy SWIR cameras series, NIT is...
New Imaging Technologies, a leader in WDR visible, SWIR & I-CMOS solutions, invites you next week on its booth at Photonics West Show for discovering its last novelties... Its new smart series camera in GigE WiDy SWIR 640G-S completing the large offer already...
Once again, we thank our customers for making a difference in 2016 with NIT technology In 2017, we invite other teams to join in and help grow the tree