NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
We are eager to welcome you at our booth #607. Everything is getting ready to give you the best experience with NIT. Until then, here is some useful information for you. Exclusive offers for you - Live demos first time ever of our newest camera WiDy SenS and MAGIC...
Are you attending SPIE Defense & Commercial Sensing 2018 Orlando from April 17th to 19th?Meet our team for discovering our solutions for Defense and Commercial applications with our last novelties: WiDy SenS cameraHigh Sensitivity & WDR SWIR camera, dual-mode...
Spring is coming and also in April. In case you might wonder what to waiting for, here is our April Show for you. 17 - 19 April 2018 - SPIE Defense & Commercial Sensing Gaylord Palms Resort & Convention Center, Orlando, Florida, United States Come to SPIE -...