NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
NIT is glad to present you its newest High Dynamic Range Global Shutter CMOSfeaturing a new Light Flicker Mitigation mode and a 12 bits digital output, for robust information in all lighting conditions. 1280 x 1024 Pixels Resolution 6.8µm Pixel Pitch On-Chip 12 bits...
Learn about gated imaging and the ability to image a slice at a specific depth in a scene. Your specific region of interest will be accurately delimited thanks to our dedicated WiDy cameras. Gated Imaging - NIT Application note from NewImagingTechnologies
We are eager to welcome you at our booth #607. Everything is getting ready to give you the best experience with NIT. Until then, here is some useful information for you. Exclusive offers for you - Live demos first time ever of our newest camera WiDy SenS and MAGIC...