NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
The Challenge of Détection and Identifying Small Drones The rapid adoption of small unmanned aerial systems (UAS) across both commercial and non-cooperative applications has significantly increased the need for effective counter-UAS (C-UAS) solutions. However,...
SWIR for SATCOM: Enabling Free-Space Optical Communication in New Space The rapid expansion of satellite communications is driving a shift toward optical (laser-based) communication systems, where Short-Wave Infrared (SWIR) technologies are emerging as a key enabler....
SWIR updates for April introduction New Imaging Technologies (NIT) continues to expand its SWIR offering this April, combining product innovation with enhanced tools for system integration. Throughout the month, NIT will engage with industry professionals at key...