NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
NIT proudly introduces new additions to its megapixel SWIR camera lineup - SenS 1280: Two new SWIR cameras: Sens 1280 CxP is an HD resolution SWIR camera with a CoaXpress video output compatible with the GenIcam protocol. Sens 1280 SDI equipped with an SDI video...
Happy Holidays! Wishing you a Merry Christmas & Happy New Year. As we approach the festive season, we would like to extend our warmest wishes to you and your team. May this holiday season bring joy, prosperity, and success to you and your loved ones. We are...
We are thrilled to announce the release of the latest versions of our powerful software solutions, NITVision 1.5 (GUI) and NITLibrary 3.4.2 (SDK), marking an advancement in our commitment to user-focused development. Enhanced OS Compatibility The new versions now...