NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
HAPPY HOLIDAYS! Merry Christmas and a Happy New Year. All for SWIR In 2021, despite the bumpy year, NIT is proud to have expanded the SWIR product line with plenty of state-of-the-art products to fit any application requirements: LiSaSWIR 2048 - Line-scan array SWIR...
Join us at booth #1854, SEMICON WEST 2021 from December 7th - 9th. We are excited to meet you in person and present our SWIR solutions to enhance your vision requirements. Don't miss the chance to test our SWIR cameras' performances on-site and discuss with our...
The new versions of NITLibrary (v3.2) and NITVision GUI (v1.2) are now available for download. In this new version, new cameras are supported: WiDy SenS 320 with USB3.0 interface (V-ST) SenS 1280 with CameraLink interface (M-ST) This update expands the range of...