NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Short-Wave Infrared (SWIR) cameras have become essential imaging tools across agriculture, defense, industrial and medical industries. These cameras utilize SWIR light in the wavelength range of 0.9-2.5 µm, which is invisible to the naked eye, to produce...
Designed to deliver superior performance for high dynamic range scenes, the NSC1201 is NIT's best fit for imaging in applications such as welding process control, additive manufacturing, and laser beam tracking/alignment. The NSC1201 is engineered to deliver a pure...
NSC2001 is the NIT Triple H(*) SWIR sensor: High Dynamic Range operating in linear and logarithmic mode response, it exhibits more than 120 dB of dynamic range High Speed, capable of generating up to 1K frames per second in full frame mode, and much more with sub...