NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Laser alignment is a vital process in many industrial and scientific applications as it ensures two or more components of a machine are aligned accurately. There are several internal and external techniques involved in laser alignment, including alignment for belts,...
Short-wave infrared (SWIR) cameras are popular in many industries because they possess unique remote sensing capabilities. SWIR cameras and their technologies are frequently used in night vision imaging and to inspect internal structures of objects without having to...
NIT Announces Updated NSC1801 - Line-Scan SWIR Sensor for Improved Performance NIT is pleased to announce the release of an updated version of its line SWIR sensor. The NSC1801 was initially designed to capture high-resolution images of linearly moving objects with...