NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Lynred Acquires New Imaging Technologies (NIT), Strengthening Leadership in Infrared Sensors We are pleased to announce that LYNRED, a leading global provider of high-quality infrared sensors for the aerospace, defense and commercial markets is acquiring New Imaging...
Boost the throughput of your inspection machine with NIT high-definition, fast-frame-rate InGaAs cameras. In the fast-paced world of semiconductor and solar panel manufacturing, precise and efficient inspection is crucial. NIT designs and manufactures high-resolution...
New Imaging Technologies (NIT), a leading innovator in advanced imaging solutions, is proud to announce the launch of its groundbreaking Full HD resolution SWIR camera. This state-of-the-art camera features ultra-low-noise performance at 25e-, designed to meet various...