NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Check what NIT brings to you in September! If you are attending SPIE 2018 in Berlin Please join us at Convention Hall 1 - Booth 504 from 11th to 12th September to explore our High Dynamic Range SWIR solutions for Security & Defense applications: Our High Dynamic...
To well support you, we are glad to announce that our new software page is available on our website: Software for SWIR Cameras and Modules. Software for Magic Cameras and Modules. Complete SDK packages for USB and GigE are available for additional development. We also...
We are glad to announce that our new application note –Thermography is available on our website and to download. Thermography is a new technique for inspection and monitoring. In this application note, you can understand the technical principle of thermography, its...