NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Dear all, The Eurosatory 2016 with 1 571 exhibitors welcomed 57 024 visitors. Were you one of them? If so, get an insight into the world of HDR Imaging technology through live presentations, face-to-face discussion, product hands-on and put our solutions to the test...
We are glad to announce to you that our new application note – Gated Imaging is available on our website and to download. Gated Imaging provides the ability to image a specific depth slice of a scene with multiple applications. In this document, you can understand...
Join NIT at Embedded Vision Summit – EVS 2018 on May 21-24, 2018 in Santa Clara, California Embedded vision is now possible in all light conditions, even in outdoor scenes with high illumination, thanks to our HDR sensor NSC1602 and MAGIC mono board*. *Our mono board...