NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip chip process insuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Once again, we thank our customers for making a difference in 2016 with NIT technology In 2017, we invite other teams to join in and help grow the tree
New Imaging Technologies is introducing to the market a new InGaAs camera with TEC VGA sensor at the forthcoming SPIE Remote Sensing Show 2016. In order to respond to numerous market demands for more accurate measurements (laser, temperature...), NIT has decided to...
New Imaging Technologies is introducing to the market a new InGaAs camera with TEC VGA sensor at the forthcoming SPIE Remote Sensing Show 2016.In order to respond to numerous market demands for more accurate measurements (laser, temperature...), NIT has decided to...