NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
NIT welcomes you at booth N7-318, DSEI 2019 London for seeing its new WiDy SenS GigE.
NIT launches a new SWIR camera on June 25th. The WiDy SenS GigE, with a proven standard interface, for industrial applications.
JOIN US ON JUNE 25th NIT NEW SWIR CAMERA LAUNCH EVENT New Imaging Technologies invites you to discover the next SWIR member of WiDy family at 2 P.M (UTC+2) on TUESDAY, JUNE 25TH. Introduce new features and advantages Demonstrate camera performance To make it...