NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
NIT will present at booth#224 at SPIE Defense & Commercial Sensing, Baltimore, USA from April 16th to 18th, 2019. Find out what NIT bring to SPIE. Until then, discover how SWIR cameras work in the laser process, in this case, additive manufacturing. Join us at...
Watch our demo to see the advantages of NIT SWIR cameras for semiconductor inspection SWIR for inspection - Reveal the heart of your material. For the past years, the SWIR band has been recognized as one of the best wavelength regions for industrial inspection....
Last Thursday, February 14, NIT had proudly presented the final pitch for the Open Innovation Defense & Space challenge of AIRBUS and MBDA. At Techinnov- Paris, NIT introduced and explained the concept in front of AIRBUS and MBDA as well as the public of...