NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
NIT Additive Manufacturing demo including WAAM and Laser Additive Manufacturing.See the melt-pool and its hydrodynamics like never before!A better definition of the melt-pool To summarize why the WiDY SWIR camera is the perfect ally for Additive manufacturing process,...
NIT launches a new SWIR Gating imaging demo video. The video illustrates the WiDy SenS Gating capabilities and how to cover several applications with a single camera. Get to know more our WiDy SenS in gating imaging application. We glad to announce that our newest...
NIT will present at booth#224 at SPIE Defense & Commercial Sensing, Baltimore, USA from April 16th to 18th, 2019. Find out what NIT bring to SPIE. Until then, discover how SWIR cameras work in the laser process, in this case, additive manufacturing. Join us at...