NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Visit us at the Digital Marketplace! Connect with New Imaging Technologies during the SPIE Photonics West Digital Forum (6th -11th March) This year’s online experience will include a free Digital Marketplace, where our latest camera will be featured. WiDy SenS 1280 -...
Dear clients and partners, We are so sorry to announce that our product's presentation at Photonics Plus at 13:30 - 18/2/2021 will be canceled due to a technical problem with the platform. Our team will still be available at our digital booth for any questions....
Perfect opportunity for you to get to know the NIT imaging solution better! NIT will present the company, SWIR products (sensors and cameras), and applications at 13:30 CET, 18th February – PhotonicsPLUS Mark your calendar and see you at our booth! Haven’t registered...