NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
NIT officially releases its latest HiPe Sens SWIR camera featuring best in class performances for low light, long exposure time applications at an affordable price.
NIT introduces new GigE viewer software and SDK in Python.
To fulfill the need for a fast and precise process monitoring, NIT has designed a specific “Soft Trigger” mode for its flagship WiDy SenS VGA InGaAs SWIR GigE Vision camera. This mode reduces the latency between the beginning of the exposure time and delivery to the host system of the produced image. Therefore, the inspection system increases the checking rate.