NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
We are thrilled to announce the release of the latest versions of our powerful software solutions, NITVision 1.5 (GUI) and NITLibrary 3.4.2 (SDK), marking an advancement in our commitment to user-focused development. Enhanced OS Compatibility The new versions now...
Solar energy has become a crucial player in the renewable energy sector, and as the demand for solar power increases, so does the importance of maintaining and optimizing solar panel efficiency. Solar panels are exposed to various environmental factors that can hinder...
NIT and INSP will exhibit the world's first HgTe CQD SWIR camera during the Forum Innovation Defense held in Paris on 23-28 November. NIT (New Imaging Technologies) and INSP (Institute of Nanosciences of Paris) are proud to announce the debut of the world's first...