NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Lytid has released the SIRIS SWIR camera - a deep cooled SWIR camera based upon a Lin/Log InGaAs sensor from NIT and image processing algorithms from the French Research Agency (CNRS). SIRIS exhibits the best performance on the market for read-out noise (<10e-) and...
New Imaging Technologies introduced to the market a new InGaAs camera with a TEC SXGA sensor - SenS 1280.Key features: Linear response mode: High sensitivity Read-out noise 27e- High QE InGaAs from 900nm to 1700nm SXGA resolution, 1280*1024 pixels Bad Pixels...
LiSaSWIR is born NIT announces a brand-new line of SWIR InGaAs camera - LiSaSWIR. This family features SWIR line-scan array camera. This SWIR camera is optimized for applications requiring short exposure times and high accuracy line rates. The LiSaSWIR delivers high...