NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Infrared sensing using nanocrystal toward on demand light matter coupling Eva Izquierdo1, Audrey Chu1,2, Charlie Gréboval1, Gregory Vincent2, David Darson3, Victor Parahyba4, Pierre Potet4, Emmanuel Lhuillier1* 1 Sorbonne Université, CNRS, Institut des NanoSciences de...
NIT is pleased to announce the sampling and production of its latest high definition SWIR image sensorNSC1901T-SI is the latest generation of NIT SWIR sensor having a pixel resolution of 1280x1024 pixels at a pitch of 10um, with the extraordinary low readout noise...
Since launching, we've incorporated a ton of great new features into our software to help you take full control of the camera. Never settle down! Today we're glad to introduce you to a brand new camera software that has been developed to simplify your workflow....