NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Lisa SWIR - The Ultimate Tool for Electronic Components, Silicon Wafers, and Solar Panels Inspection. Lisa SWIR is a line scan SWIR camera using the NSC1801 SWIR sensor developed by NIT which has 2048 pixels, with a pixel size of 7.5um x 7.5um. The line repetition...
NIT expands its SWIR camera portfolio with the latest SenS 1280S-VT model which integrates NIT 1280x1024pixel @ 10um sensor. The camera operates with a USB3 output and is bundled with GUI - NITVISION software and SDK for major operating systems. Sens1280V-ST exhibits...
New Imaging Technologies (NIT) thanks the French Government for their support with the “France Relance” Program in developing the industrialization of our novel in-house stacking technology, recognizing NIT’s breakthrough R&D process development in SWIR sensor...