NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
2025 SWIR Camera Performance Milestones and Prepares for 2026 As 2025 comes to a close, New Imaging Technologies (NIT) highlights the key achievements that have shaped its SWIR camera roadmap over the past year. Throughout 2025, NIT continued to strengthen its...
Introduction High-speed SWIR cameras and line-scan SWIR cameras are becoming essential tools for modern industrial inspection, semiconductor manufacturing, laser monitoring, and other advanced imaging fields where speed, sensitivity, and reliability are critical. As...
New Imaging Technologies Announces LiSaSWIR 2048 v2 – Next-Generation SWIR Line-Scan Camera Featuring new NSC2301Sensor Introduction of new SWIR Line-scan Camera New Imaging Technologies (NIT), a leading French manufacturer of InGaAs SWIR sensors and cameras,...