NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
NIT (New Imaging Technologies) introduces its latest innovation in the realm of SWIR imaging technology: a high-resolution Short-Wave Infrared (SWIR) InGaAs sensor designed for the most demanding challenges in the field. Overview The new SWIR sensor - NSC2101 boasts...
Join us at booth #1232 - SWIR cameras for Defense & Commercial Sensing applications Pierre POTET our CEO, François Coursaget and Regis TULAZA will be pleased to present our latest innovative cameras amongst which SenS 1280 - OEM version WiDy SenS 320 -...
We are thrilled to announce the new High-Speed SWIR camera version, a cutting-edge addition to our WiDy SenS 320 series. This new iteration boasts an impressive 10kHz (ROI) frame rate, alongside a minimum exposure time of 1µs, all seamlessly integrated into a USB 3.0...