NIT is quickly ramping up with production of InGaAs stacked sensors

Jul 26, 2022 | News

NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.

One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip chip process insuring high yield and low cost of production.

The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.

Number of hybrid InGaAs sensors produced with the in house process developed by NIT

Recent news

The Largest Portfolio of SWIR Sensors of the Imaging Industry

The Largest Portfolio of SWIR Sensors of the Imaging Industry

NIT is widely known for its large range of SWIR cameras designed for industrial, defense, and medical markets. Less known is that NIT designs and manufactures in-house all the InGaAs sensors embedded into our cameras. We master the design of silicon read-out circuits,...

October trade shows invitations

October trade shows invitations

Test our products up close, and get first-hand information about new arrivals.  Welcome to our October events! 4th - 6th, October VISION 2022 Messe Stuttgart, Germany SenS 1280 at Booth #10B24 Are you heading to Stuttgart for VISION 2022 from Oct 4th - 6th? We will be...

Join NIT at OPTRO 2022

Join NIT at OPTRO 2022

During OPTRO 2022 conference, held in Versailles from June 8th to 10th, New Imaging Technologies (NIT) will be present through the following talks:Thursday, 9th @ 11h40Novel Photodiode design for small pitch InGaAs Sensors NITThursday, 9th @ 15h00HgTe Nanocrystal...