NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
NIT's events 2026 This autumn, New Imaging Technologies (NIT), part of LYNRED, will be showcasing its latest short-wave infrared (SWIR) imaging solutions (0.9-1.7 µm) at several key industry events across machine vision, semiconductor, defense, aerospace, and...
SWIR for Earth Observation and Space Applications Short-Wave Infrared (SWIR) imaging is playing an increasingly important role in Earth observation and space applications, enabling advanced analysis capabilities across environmental monitoring, industrial inspection,...
SWIR for Firefighting In the chaos of a fire, every second counts—but smoke can blind even the most experienced firefighters. Traditional visible light cameras struggle in dense smoke, haze, or dust, leaving first responders at a disadvantage when they need clarity...