NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
New Imaging Technologies (NIT) announces the release of its latest SWIR InGaAs line scan sensor, the NSC2301, designed for demanding industrial inspection applications. With advanced features and performance, this new sensor sets a benchmark in SWIR imaging for...
New Imaging Technologies (NIT) is pleased to share an impressive video from a recent long-range imaging demonstration using our SenS 1920 Full-HD SWIR camera. This test highlights its capabilities in extreme observation scenarios, spanning distances up to 84...
New Imaging Technologies (NIT) announces the release of the SenS 1920 CameraLink, now available for purchase starting May 2025. This Full HD SWIR camera delivers exceptional image quality and low noise performance, now with CameraLink interface support to provide...