NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
SWIR Drone-Based Imaging for Solar Panel Inspection Why Use SWIR for Solar Panel Inspection? Benefits of SWIR Drone-Based Inspection NIT SWIR InGaAs Solutions for UAV Integration Conclusion: The Future of SWIR Drone Inspection SWIR Drone-Based Inspection Introduction...
Introduction New Imaging Technologies (NIT), a LYNRED company, announces that theLiSa SWIR 2048R M-STE2 is now available for order. The camera was first presented at SPIE Photonics West 2026 and is now ready for commercial deployment. Rectangular-Pixel SWIR Camera...
Introduction NIT Launches LiSa SWIR 2048R M-STE2, Rectangular SWIR Camera at SPIE Photonics West 2026 New Imaging Technologies (NIT) announces the launch of LiSa SWIR 2048R M-STE2, a new rectangular-pixel SWIR camera based on the proven LiSaSWIR 2048 v2 platform. The...