NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Long-range imaging presents challenges, especially in poor weather conditions. Short-Wave Infrared (SWIR) technology enhances visibility beyond the visible spectrum. Unlike visible cameras, which struggle in fog, rain, and low-light environments, SWIR sensors provide...
New Imaging Technologies (NIT) announces a new partnership with Mountain Photonics, a distributor specializing in advanced photonics solutions. This collaboration strengthens NIT's presence in key European markets, particularly Germany, by leveraging Mountain...
Thank you for your continued trust and support. Your partnership inspires us, and we wish you all the best for the coming year. 2024 has been a remarkable year for NIT, filled with exciting advancements: SenS 1920 - Full HD SWIR camera: Ultra-high sensitivity with...