NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
New Imaging Technologies Announces LiSaSWIR 2048 v2 – Next-Generation SWIR Line-Scan Camera Featuring new NSC2301Sensor Introduction of new SWIR Line-scan Camera New Imaging Technologies (NIT), a leading French manufacturer of InGaAs SWIR sensors and cameras,...
SWIR Cameras for Ground-Based Laser Communication: Clearer Signals, Even in Harsh Conditions Ground-based laser communication systems are key to enabling ultra-fast, high-bandwidth data transmission between fixed stations, satellites, or mobile units. However,...
New Imaging Technologies (NIT) announces the release of the WiDy SenS 320 SWIR camera with GigE interface, offering increased flexibility for system integrators across industrial, scientific, and laser imaging markets. Designed and manufactured in France, this...