New Imaging Technologies (NIT) thanks the French Government for their support with the “France Relance” Program in developing the industrialization of our novel in-house stacking technology, recognizing NIT’s breakthrough R&D process development in SWIR sensor production. NIT will be able to address volume production and high-resolution SWIR sensors with this industrialization process
SWIR Camera Backend Inspection: Seeing Through Silicon in Advanced Packaging
SWIR Camera Backend Inspection: Seeing Through Silicon in Advanced Packaging A SWIR camera backend inspection setup works because silicon is opaque in the visible range but transparent from ~900 to 1700 nm. An InGaAs SWIR camera therefore images through dies, wafers...
