NIT controls and masters in-house all the design and manufacturing phases of its InGaAs focal plane arrays.
One of the critical steps is the 3D stacking of the photodiode array to the read-out circuit, for which NIT has developed a very innovative flip-chip process ensuring high yield and low cost of production.
The 3D stacking process is able to produce FPA’s from pitch of 7.5um to 15um, studies are underway to lower this limit.
Perfect opportunity for you to get to know the NIT imaging solution better! NIT will present the company, SWIR products (sensors and cameras), and applications at 13:30 CET, 18th February – PhotonicsPLUS Mark your calendar and see you at our booth! Haven’t registered...
NIT is pleased to announce the release of several new SWIR sensors now produced with NIT in-house designed stacking technology, internally named NH. The NH technology allows to stack a photodiode array (PDA) of InGaAs to a CMOS read out circuit (ROIC) at pixel level....
New software development kit 3.0 We are excited to announce the release of our new SDK - NITLibrary 3.0 In the last few months, we have been tirelessly working to improve our product and we believe that the new SDK will help you conquer even more new horizons in your...